I. Why Choose Aramid Fiber? 3 Core Technical Advantages
- Molecular-Level Stability
- Withstands Continuous High Temperatures of 300℃ (UL Certification Data)
- Dielectric Loss <0.02% in Acid/Alkali Environments (ASTM D149 Test Comparison Table)
- Ultra-Low Dielectric Constant
- Dielectric Constant of 2.8-3.2 at 1MHz Frequency (Compared to Epoxy Resin 4.5+)
- Energy Consumption Reduced by 30% in High-Frequency Scenarios (Case Data from a 5G Base Station)
- Mechanical Strength Breakthrough
- Tensile Strength ≥20cN/dtex (200% Higher than Glass Fiber)
- Custom Weaving Process Achieves Ultra-Thin Insulation Layer of 0.05mm (SEM Micrograph)
II. 5 Key Application Scenarios in Electrical Insulation Field
- High-Voltage Cable Insulation Solution
- Technical Parameters:
- Breakdown Voltage ≥40kV/mm (IEC 60243 Standard)
- CTI ≥600V (Compared to Silicone Rubber Material Performance Table)
- Typical Customer: Annual Cost Reduction of 12 Million Yuan for a Power Grid Project (Project Excerpt Report Attached)
- New Energy Vehicle Motor Insulation System
- Temperature Resistance Class H (180℃) Compatible with Flat Wire Motor Process
- Oil Resistance Test: Volume Expansion Rate <3% After 1000h Soaking (GB/T 1690 Data)
- Innovative Aramid Insulation Paper Scheme for Transformers
- Dielectric Strength ≥100kV/mm at 0.08mm Thickness
- Shortened Delivery Cycle by 40% for an Ultra-High Voltage Project (Customer Testimonial Screenshot)
- Wind Power Equipment Weather Resistance Insulation Protection
- No Corrosion After 3000h Salt雾 Test (IEC 61701 Certification)
- Custom Prepreg Reduces Processing Energy Consumption by 25% (Process Flow Chart)
- Aerospace Harness Lightweight Design
- Density 1.44g/cm³ Achieves Weight Reduction of 35% (Boeing Supply Chain Case)
III. 4 Frontier Application Directions in Electronic Field
- 5G High-Frequency PCB Substrate Reinforcement Material
- Dielectric Loss ≤0.004 at 10GHz (Performance Comparison Table with PTFE)
- Thermal Expansion Coefficient Matches Copper Foil (CTE <10ppm/℃)
- Flexible Display Circuit Encapsulation Technology
- Bendable Over 100,000 Times (IPC-6013 Standard Test)
- Wave Transmission Rate >92% Meets Foldable Screen Requirements (Cooperation Dynamics with OPPO/Vivo Attached)
- Semiconductor Equipment Corrosion-Resistant Protective Layer
- Passed HF Acid Corrosion Test According to SEMI F47 Standard
- Annual Maintenance Cost Reduction of 8 Million Yuan for a Wafer Factory (NDA Confidential Data Overview)
- Military-Grade Electromagnetic Shielding Composite Material
- Shielding Effectiveness of 30-40dB (Test Report for 1-10GHz Frequency Band)
- Anti-Ballistic Impact Composite Structure Design (Patent Technology Display)
IV. Industry Selection Guide
- Technical Selection ComparisonCustom Development Service
| Index | General Grade | High Modulus Grade | Conductive Composite Grade |
| Tensile Strength | 18cN/dtex | 25cN/dtex | 15cN/dtex |
| Surface Resistivity | >1E15Ω | >1E15Ω | 1E3-1E6Ω |
| Applicable Scenario | Cable | Satellite Components | Anti-Static Packaging |
- Custom Development Service
- Fiber Diameter Customization: Precision Control of 0.5-5μm
- Surface Modification Treatment: Plasma/Silane Coupling Agent Optional
- Composite Process Support: Blending Technology with PI/PEEK
- Cost Optimization Strategy
- Bulk Purchase Tiered Quotation (Pricing List Starting from 100kg)
- Regional Warehousing Network (48-Hour Delivery Commitment in China, the US, and Europe)
V. Authority Certification and Customer Cases
- Certification System: UL94 V-0 / RoHS / REACH / MIL-STD-810G
- Typical Cooperation:
- Huawei 5G Base Station Electromagnetic Shielding Project (Continuous Supply from 2019-2023)
- Exclusive Supply for State Grid Ultra-High Voltage Project (Excerpt from Bidding Announcement)
